Copper layers on PCBs are often coated with other metals in the production process. In order to form a firm bond, the surface of the copper is etched. Typically this is achieved by treating with an acidic persulphate formulation.

Using the ultrasonic process developed by Susonence, the same etching rate (weight loss) can be achieved using a lower concentration of chemicals. The surface produced is also superior for coating, proving a more consistent roughened surface to aid adhesion. The graph below shows the improved weight loss at various chemical concentrations when using the Susonence process.

improved weight loss

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