Events

Featured events


EIPC Winter Conference

Susonence was presented in Geneva, Switzerland on the 30th and 31st January 2014

EIPC Winter Conference

 

WECC Exhibition

Susonence was presented by the EIPC at the WECC Exhibition TPCA,Taiwan - October 23-25th 2013.

 

EIPC at the WECC Exhibition TPCA, Taiwan

 

Productronica

Meet the Susonence team at Productronica, Munich, Germany - November 12-15th 2013.

 

Productronica, Munich

 

EIPC Summer conference

The European Institute of Printed Circuits (EIPC) held their summer conference on June 27 & 28, 2013 in Luxembourg City. The audience included companies and individuals active in the Packaging and Interconnection Industry. This conference is an absolute ‘must’ for companies associated with PCB fabrication who wish to stay up to date with the latest market requirements, materials, fabrication equipment and manufacturing processes who also need to improve the efficiency of their processes and the reliability of their products. The Susonence project was presented by Stuart Dalrymple of C-Tech Innovation – the presentation can be seen here.

The findings sparked discussions on the energy and chemical savings that could be achieved by the use of ultrasound. A poster was also presented at the networking sections of the event. Susonence project partners Env-Aqua, Pragoboard and EIPC were represented at the event. A short video clip of the EIPC conference can be seen here.

 

Interfinish 2012

IPM2 presented the Susonence project at The World Interfinish Congress of 2012. Organized every 4 years by IUSF (International Union of Surface Finishing), Interfinish 2012 was held in Milano Italy, in the region where the first electrodeposition experiment was realized by V.Brugnatelli in 1800.

Many other Regional congresses had also taken place with the name of Euro-Interfinish, Asian-Interfinish in the intervals between the World Interfinish congresses. In the world of the surface finishing technologies innovations are increasing with the increase of the possible applications of decorative and functional coatings. Surface is now the most important part of an object, because it is through the surface that it becomes connected with the world outside. Its resistance to corrosion and wear, its appearance and its functionality give quality to the part and render it easy to apply.


EIPC Winter Conference 2012

Michael Weinhold presented the Susonence project at the EIPC winter conference in Berlin.

 

Full Events List


Event

Date

 

EIPC stand @ Productronica 2011,Germany

  • Flyers

 

November 2011

 

EIPC Winter ConferencePrague,Czech Republic

  • Presentation @ conference
  • Flyers

Number of attendees: 80

 

 

February 2-3, 2012

 

EIPC stand @ WECC Exhibition IPC Apex,USA

  • Flyers

 

February 28-March 15, 2012

 

EIPC stand @ WECC Exhibition CPCA,China

  • Flyers

 

March 13-15, 2012

 

EIPC stand @ SMT HYBRID/PACKAGING,Germany

  • Poster
  • Flyers

 

May 8-10, 2012

 

JISSO meetings during SMT,Germany

  • Flyers

 

May 8-10, 2012

 

EIPC stand @ WECC Exhibition KPCA, Korea

  • Poster
  • Flyers

 

May 15-17, 2012

 

EIPC stand @ WECC Exhibition JPCA,Japan

  • Poster
  • Flyers

 

June 13-15, 2012

 

EIPC stand @ WECC Exhibition IPCA,India

  • Poster
  • Flyers

 

July 25-27, 2012

 

EIPC Summer ConferenceMilan,Italy

  • Presentation @ conference: by Andy Cobley
  • Poster
  • Flyers

Number of attendees: 70


 

September 13-14, 2012

 

EIPC stand @ WECC Exhibition TPCA,Taiwan

  • Poster
  • Flyers

 

October 24-26, 2012

 

EIPC stand @ Electronica 2012,Germany

  • Poster
  • Flyers

 

November 13-16, 2012

 

EIPC stand @ WECC Exhibition HKPCA,Hong Kong

  • Poster
  • Flyers

 

December, 2012

 

EIPC WinterConferenceBerlin,Germany

  • Poster
  • Flyers

Number of attendees: 90

 

 

January 31 & February 1, 2013

 

 

EIPC stand @ WECC Exhibition IPC Apex,USA

  • Poster
  • Flyers

 

February 19-21, 2013

 

 

Ampere 2013, Future Technologies Exhibition and Conference,Brno,Czech Republic, 21st March, 2013

  • Presentation

Number of attendees - 140

 

 

March 21 2013.

 

 

EIPC stand @ WECC Exhibition CPCA,China

  • Poster
  • Flyers

 

 

March 19-21, 2013

 

 

EIPC stand @ SMT Hybrid Packaging Exhibition, Nuremberg,Germany

  • Poster
  • Flyers

 

April 16-18, 2013

 

EIPC stand @ WECC Exhibition KPCA,Korea

  • Poster
  • Flyers

April 23-25, 2013

 

 

EIPC stand @ WECC Exhibition HKPCA,Hongkong,China

  • Poster
  • Flyers

 

Nov-27-29, 2013

 

 

EIPC Stand @ WECC Exhibition JPCA,Japan

  • Poster
  • Flyers

 

June 5-7, 2013

 

 

TransFair, Gaydon

  • Poster
  • Flyers

 

June 11-13, 2013

 

EIPC stand @ WECC Exhibition IPCA,India

  • Poster
  • Flyers

 

August 29-31, 2013

 

 

EIPC Summer ConferenceLuxembourg,Luxembourg

  • Presentation @ conference: by Andy Cobley
  • Presentation @ cnoference: by Stuart Dalrymple
  • Poster
  • Flyers

Number of attendees expected: 75

 

 

June 27-29, 2013

 

EIPC stand @ WECC Exhibition TPCA,Taiwan

  • Poster
  • Flyers

 

October 23-25, 2013

 

EIPC stand @ Productronica, Munich,Germany

  • Poster
  • Flyers

 

November 12-15, 2013

 

EIPC annual Winter Conference in Geneva, Switzerland

  • Poster
  • Presentation

 

January 30-31, 2014

 

13th Electronic Circuits World Convention (ECWC13), in Nuremberg, Germany

 

 

May 7-9, 2014

 

Additional activities:

  • SUSONENCE logo EIPC
  • SpeedNews
    • Appr. 5000 circulation
    • 45 Issues per annum
  • Event mailings
    • 8 per year
    • Appr. 5000 circulation
  • SUSONENCE page on EIPC website

 


  • Aspects of project were presented to Prof Bund, Technical University Ilmenau,Germany

 

July 3-4 2013


  • ICT Evening seminar, Darlington, UK– presentation by Andy Cobley– “Ultrasonically Enhanced Surface Modification Processes

 

November 5th, 2013


  • Jaguar Land Rover,  Gaydon Centre – aspects of project were presented to Materials Research Team

 

December 12th, 2013

Additional information